Augmodo is at the forefront of Spatial AI, where mapping connects the digital and physical worlds, through devices such as smart badges at retail stores. We are seeking a Systems Integration Engineer with deep experience in board bring-up, hardware validation, and embedded system integration, especially for platforms involving MIPI cameras, ISP pipelines, and wireless connectivity. You will play a central role in bringing up new boards, enabling hardware interfaces, and debugging system-level issues across the hardware-software boundary.

This role is ideal for engineers who thrive in low-level debugging, cross-functional hardware interactions, and camera sensor system tuning—not pure firmware development.

Key Responsibilities

• Lead initial board bring-up of embedded Linux or Android-based systems (e.g. Qualcomm, Rockchip, NXP, or custom platforms).

• Validate and enable hardware interfaces including MIPI CSI/DSI, ISP, Wi-Fi, SPI, CAN, and I2C.

• Work hands-on with new PCB builds to validate power rails, clocks, and connectivity; bring up peripherals and core components.

• Collaborate with camera vendors and ISP teams to tune image quality and integrate sensor drivers into the stack.

• Debug cross-layer issues spanning bootloaders (U-Boot), device trees, drivers, kernel logs, and vendor blobs.

• Serve as the technical point of contact for hardware ODMs and component vendors, especially in Asia.

• Support integration of system services, thermal management, and power profiling at the board level.

• Provide feedback to hardware teams during design and EVT/DVT/PVT stages.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.

• 5+ years of experience in embedded system bring-up or hardware validation roles.

• Proficiency in Linux or Android platform bring-up, device tree configuration, and low-level debug tools.

• Strong hands-on experience with oscilloscopes, logic analyzers, and debugging hardware interfaces (MIPI, SPI, etc.).

• Experience with camera systems, including MIPI camera sensor tuning and integration with ISP stacks.

• Familiarity with wireless modules (Wi-Fi/BT) and debugging RF-level integration issues.

• Comfort working with remote hardware teams and manufacturers, including review of schematics and PCB layouts.

• Bonus: Exposure to BSP development or integration experience with Rockchip, Qualcomm, or other SoC vendors.

$155,000 - $210,000 USD + Equity

Additional Information

At this time, we are unable to provide work authorization or visa sponsorship. To be considered for a role at Augmodo, you must be currently authorized to work in the USA, Canada, or the UK without the need for sponsorship now or in the future.

Augmodo provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, sex, national origin, age, disability, or genetics. In addition to federal law requirements, Augmodo complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company hires. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, transfer, leaves of absence, compensation, and training.

Augmodo expressly prohibits any form of workplace harassment based on race, color, religion, gender, sexual orientation, gender identity or expression, national origin, age, genetic information, disability, or veteran status. Improper interference with the ability of Augmodo's employees to perform their job duties may result in discipline up to and including discharge.